技术参数
AC适配器:
18.9 x 14.6 x 15.0 in / 32.43 lb
环境工作温度:
10 to 40 C / 50 to 104 F
局域网（以太网）:
Remote control / Traceability
峰值功率:
160 W per tool � 23.5 V
真空:
75% / 570 mmHg / 22.4 inHg
Selectable Temperature:
90 to 450 C / 190 to 840 F
Max. and min. temperature:
Limit the temperature range in which the operator is allowed to work.
Voltage (AC):
ref. DMPSE-1QA - 120 V
Package:
480 x 370 x 380 mm / 14.71 kg
Temperatue levels:
Instant selection of up to 3 editable temperature settings for solder joints with different heat requirement.
PIN protection:
Keep station parameters protected against unauthorized access.
Sleep and Hibernation mode:
These modes lower soldering tip temperature when the tool rests in the stand in order to avoid oxidation and extending tip life.
USB-B (rear):
Software PC / Traceability
USB-A (front):
Firmware update.
Robot:
RS-232 remote control or Smart Fume Extractor connection
Dynamic Soldering Profiles:
Designed to avoid thermal shock when soldering Ceramic Chip components like MLCC, this new and unique feature allows controlling the heating ramp up rate of the tool to gradually increase the temperature of the
Soldering graphics:
Real time visualization of tip temperature and power delivered to the solder joint during soldering process.
10 user interface languages:
English, German, Spanish, French, Italian, Portuguese, Russian, Japanese, Korean, Chinese.
PS:
Interconnection of up to 5 PSE control units to manage up to 24 tools simultaneously.
Dimensions/Net weight:
See individual modules
DMPSE-2QA精密焊台
